Bandai Xxxg-01w Wing Gundam Hgac 1/144 Gunpla Model Kit
Sale!

Bandai Xxxg-01w Wing Gundam Hgac 1/144 Gunpla Model Kit

Original price was: $12.36.Current price is: $3.70.

SKU: 7138967879838 Category:

Description

Discover the thrill of model building with the Bandai XXXG-01W Wing Gundam HGAC 1/144 Gunpla Model Kit. This detailed model kit brings the iconic Wing Gundam to life, featuring precise design and articulation that captures the essence of this beloved character from the Gundam series. Crafted by Bandai, a renowned manufacturer known for high-quality figures and model kits, this kit promises an engaging and rewarding assembly experience.

Perfect for both Gunpla enthusiasts and newcomers, the High Grade After Colony (HGAC) 1/144 scale Wing Gundam model combines intricate detail with ease of assembly. The finished model is highly posable, allowing for dynamic display options, making it a standout piece for any collector or fan of the Gundam universe.

Details

• Specifications:

  • Assembly required
  • Articulated
  • High Grade (HGAC) model kit
  • 1/144 scale

• Condition: Brand New

• Product Material: Plastic

• Manufacturer: Bandai

• Recommended Age: 15+

Features

  • Highly detailed model of the Wing Gundam from the Gundam series
  • Includes articulated joints for dynamic posing
  • High Grade After Colony (HGAC) quality for enhanced detail and build experience
  • 1/144 scale size suitable for display and collection
  • Requires assembly; no painting necessary but optional for customization

Care instructions

Handle the model with care to avoid damaging delicate parts. Use a soft, dry cloth to clean dust from the model. Avoid exposure to direct sunlight to prevent discoloration. Store in a dust-free environment or display case to maintain its condition. When assembling or disassembling, follow instructions carefully to avoid breaking components.

Reviews

There are no reviews yet.

Be the first to review “Bandai Xxxg-01w Wing Gundam Hgac 1/144 Gunpla Model Kit”

Your email address will not be published. Required fields are marked *